Diurethane (meth)acrylate-silane compositions and articles including the same

ABSTRACT

Diurethane (meth)acrylate-silane precursor compounds prepared by reacting a primary or secondary aminosilane with a cyclic carbonate to yield a hydroxylalkylene-carbamoylalkylene-alkoxysilanes (referred to as a “hydroxylcarbamoylsilane”), which is reacted with a (meth)acrylated material having isocyanate functionality, either neat or in solvent, and optionally with a catalyst, such as a tin compound. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one diurethane (meth)acrylate-silane precursor compound. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making the diurethane (meth)acrylate-silane and their use in composite films and electronic devices are described.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Nos.61/681,003; 61/681,008; 61/681,023; 61/681,051; and 61/680,995, allfiled on Aug. 8, 2012, the disclosures of which are incorporated byreference herein in their entireties.

FIELD

The present disclosure relates to the preparation of diurethane(meth)acrylate-silane compounds and their use in preparing compositebarrier assemblies. More particularly, the disclosure relates tovapor-deposited protective (co)polymer layers including the reactionproduct of at least one diurethane (meth)acrylate-silane precursorcompound, used in multilayer composite barrier assemblies in articlesand barrier films.

BACKGROUND

Inorganic or hybrid inorganic/organic layers have been used in thinfilms for electrical, packaging and decorative applications. Theselayers can provide desired properties such as mechanical strength,thermal resistance, chemical resistance, abrasion resistance, moisturebarriers, and oxygen barriers. Highly transparent multilayer barriercoatings have also been developed to protect sensitive materials fromdamage due to water vapor. The water sensitive materials can beelectronic components such as organic, inorganic, and hybridorganic/inorganic semiconductor devices. The multilayer barrier coatingscan be deposited directly on the sensitive material, or can be depositedon a flexible transparent substrate such as a (co)polymer film.

Multilayer barrier coatings can be prepared by a variety of productionmethods. These methods include liquid coating techniques such assolution coating, roll coating, dip coating, spray coating, spincoating; and dry coating techniques such as Chemical Vapor Deposition(CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), sputtering andvacuum processes for thermal evaporation of solid materials. Oneapproach for multilayer barrier coatings has been to produce multilayeroxide coatings, such as aluminum oxide or silicon oxide, interspersedwith thin (co)polymer film protective layers. Each oxide/(co)polymerfilm pair is often referred to as a “dyad”, and the alternatingoxide/(co)polymer multilayer construction can contain several dyads toprovide adequate protection from moisture and oxygen. Examples of suchtransparent multilayer barrier coatings and processes can be found, forexample, in U.S. Pat. No. 5,440,446 (Shaw et al.); U.S. Pat. No.5,877,895 (Shaw et al.); U.S. Pat. No. 6,010,751 (Shaw et al.); U.S.Pat. No. 7,018,713 (Padiyath et al.); and U.S. Pat. No. 6,413,645 (Graffet al.).

SUMMARY

In one aspect, the present disclosure features compositions of matterincluding at least one diurethane (meth)acrylate-silane compound of theformulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]—O—C(O)—N(R⁵)—R_(S).R_(A) is a (meth)acryl group containing group of the formulaR¹¹-(A)_(n), wherein R¹¹ is a polyvalent alkylene, arylene, alkarylene,or aralkylene group, said alkylene, arylene, alkarylene, or aralkylenegroups optionally containing one or more catenary oxygen atoms; A is a(meth)acryl group comprising the formula X²—C(O)—C(R³)═CH₂, furtherwherein X² is —O, —S, or —NR³, R³ is independently H, or C₁-C₄, and n=1to 5. In addition, each R¹², R¹³, R¹⁴, R¹⁵, R¹⁶, and R¹⁷ isindependently H, a linear, branched or cyclic alkyl group of 1 to 6carbon atoms, optionally including 1 to 3 catenary oxygen, sulfur, ornitrogen atoms, and optionally substituted with one or more hydroxylgroups. Furthermore, R_(S) is a silane containing group of the formula—R¹—[Si(Y_(p))(R²)_(3-p)]_(q), wherein R¹ is a polyvalent alkylene,arylene, alkarylene, or aralkylene group, said alkylene, arylene,alkarylene, or aralkylene group, optionally containing one or morecatenary oxygen atoms; Y is a hydrolysable group, R² is a monovalentalkyl or aryl group, p is 1, 2, or 3, and q is independently 1 to 5. R⁵is H, C₁ to C₆ alkyl, C₁ to C₆ cycloalkyl, or R_(S); and a is 0, 1, or2.

In any of the foregoing embodiments, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary embodimentsof the foregoing, at least some of the hydrolysable groups Y are alkoxygroups.

In another aspect, the present disclosure describes articles including acomposite barrier assembly further including a substrate selected from a(co)polymeric film or an electronic device, the electronic devicefurther including an organic light emitting device (OLED), anelectrophoretic light emitting device, a liquid crystal display, a thinfilm transistor, a photovoltaic device, or a combination thereof; a base(co)polymer layer on a major surface of the substrate; an oxide layer onthe base (co)polymer layer; and a protective (co)polymer layer on theoxide layer. The protective (co)polymer layer includes the reactionproduct of at least one of the foregoing diurethane(meth)acrylate-silane precursor compounds of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),as described above. The protective (co)polymer layer includes thereaction product of at least one of the foregoing diurethane(meth)acrylate-silane precursor compounds of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),as described above.

In certain presently preferred exemplary embodiments of the foregoingarticles, the substrate is a (co)polymeric film. In some exemplaryembodiments of any of the foregoing articles, the substrate is aflexible transparent (co)polymeric film, optionally wherein thesubstrate comprises polyethylene terephthalate (PET), polyethylenenapthalate (PEN), heat stabilized PET, heat stabilized PEN,polyoxymethylene, polyvinylnaphthalene, polyetheretherketone, afluoro(co)polymer, polycarbonate, polymethylmethacrylate, poly α-methylstyrene, polysulfone, polyphenylene oxide, polyetherimide,polyethersulfone, polyamideimide, polyimide, polyphthalamide, orcombinations thereof. In other exemplary embodiments of any of theforegoing composite films, the base (co)polymer layer includes a(meth)acrylate smoothing layer.

In any of the foregoing articles, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary embodimentsof the foregoing articles, at least some of the hydrolysable groups Yare alkoxy groups.

In additional exemplary embodiments of any of the foregoing articles,the article further includes a multiplicity of alternating layers of theoxide layer and the protective (co)polymer layer on the base (co)polymerlayer.

In further exemplary embodiments of any of the foregoing articles, theoxide layer includes at least one oxide, nitride, carbide or boride ofatomic elements selected from Groups IIA, IIIA, IVA, VA, VIA, VIIA, IB,or IIB, metals of Groups IIIB, IVB, or VB, rare-earth metals, or acombination or mixture thereof. In some exemplary embodiments of any ofthe foregoing composite films, the composite film further includes anoxide layer applied to the protective (co)polymer layer, optionallywherein the oxide layer includes silicon aluminum oxide.

In a further aspect, the disclosure describes methods of using acomposite film as described above in an article selected from aphotovoltaic device, a solid state lighting device, a display device,and combinations thereof. Exemplary solid state lighting devices includesemiconductor light-emitting diodes (SLEDs, more commonly known asLEDs), organic light-emitting diodes (OLEDs), or polymer light-emittingdiodes (PLEDs). Exemplary display devices include liquid crystaldisplays, OLED displays, and quantum dot displays.

In another aspect, the disclosure describes a process including: (a)applying a base (co)polymer layer to a major surface of a substrate, (b)applying an oxide layer on the base (co)polymer layer, and (c)depositing on the oxide layer a protective (co)polymer layer, whereinthe protective (co)polymer layer includes a (co)polymer formed as thereaction product of at least one of the foregoing diurethane(meth)acrylate-silane precursor compound of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),as described above. The substrate is selected from a (co)polymeric filmor an electronic device, the electronic device further including anorganic light emitting device (OLED), an electrophoretic light emittingdevice, a liquid crystal display, a thin film transistor, a photovoltaicdevice, or a combination thereof.

In some exemplary embodiments of the process, the at least onediurethane (meth)acrylate-silane precursor compound undergoes a chemicalreaction to form the protective (co)polymer layer at least in part onthe oxide layer. Optionally, the chemical reaction is selected from afree radical polymerization reaction, and a hydrolysis reaction.

In any of the foregoing processes, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary embodimentsof the foregoing articles, at least some of the hydrolysable groups Yare alkoxy groups.

In some particular exemplary embodiments of any of the foregoingprocesses, step (a) includes (i) evaporating a base (co)polymerprecursor, (ii) condensing the evaporated base (co)polymer precursoronto the substrate, and (iii) curing the evaporated base (co)polymerprecursor to form the base (co)polymer layer. In certain such exemplaryembodiments, the base (co)polymer precursor includes a (meth)acrylatemonomer.

In certain particular exemplary embodiments of any of the foregoingprocesses, step (b) includes depositing an oxide onto the base(co)polymer layer to form the oxide layer. Depositing is achieved usingsputter deposition, reactive sputtering, chemical vapor deposition, or acombination thereof. In some particular exemplary embodiments of any ofthe foregoing processes, step (b) includes applying a layer of aninorganic silicon aluminum oxide to the base (co)polymer layer. Infurther exemplary embodiments of any of the foregoing processes, theprocess further includes sequentially repeating steps (b) and (c) toform a multiplicity of alternating layers of the protective (co)polymerlayer and the oxide layer on the base (co)polymer layer.

In additional exemplary embodiments of any of the foregoing processes,step (c) further includes at least one of co-evaporating the at leastone diurethane (meth)acrylate-silane precursor compound with a(meth)acrylate compound from a liquid mixture, or sequentiallyevaporating the at least one diurethane (meth)acrylate-silane precursorcompound and a (meth)acrylate compound from separate liquid sources.Optionally, the liquid mixture includes no more than about 10 wt. % ofthe diurethane (meth)acrylate-silane precursor compound. In furtherexemplary embodiments of such processes, step (c) further includes atleast one of co-condensing the diurethane (meth)acrylate-silaneprecursor compound with the (meth)acrylate compound onto the oxidelayer, or sequentially condensing the diurethane (meth)acrylate-silaneprecursor compound and the (meth)acrylate compound on the oxide layer.

In further exemplary embodiments of any of the foregoing processes,reacting the diurethane (meth)acrylate-silane precursor compound withthe (meth)acrylate compound to form a protective (co)polymer layer onthe oxide layer occurs at least in part on the oxide layer.

Some exemplary embodiments of the present disclosure provide compositebarrier assemblies, articles or barrier films which exhibit improvedmoisture resistance when used in moisture exposure applications.Exemplary embodiments of the disclosure can enable the formation ofbarrier assemblies, articles or barrier films that exhibit superiormechanical properties such as elasticity and flexibility yet still havelow oxygen or water vapor transmission rates.

Exemplary embodiments of barrier assemblies or barrier films accordingto the present disclosure are preferably transmissive to both visibleand infrared light. Exemplary embodiments of barrier assemblies orbarrier films according to the present disclosure are also typicallyflexible. Exemplary embodiments of barrier assemblies or barrier filmsaccording to the present disclosure generally do not exhibitdelamination or curl that can arise from thermal stresses or shrinkagein a multilayer structure. The properties of exemplary embodiments ofbarrier assemblies or barrier films disclosed herein typically aremaintained even after high temperature and humidity aging.

Various aspects and advantages of exemplary embodiments of the presentdisclosure have been summarized. The above Summary is not intended todescribe each illustrated embodiment or every implementation of thepresent invention. Further features and advantages are disclosed in theembodiments that follow. The Drawings and the Detailed Description thatfollow more particularly exemplify certain preferred embodiments usingthe principles disclosed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are incorporated in and constitute a part ofthis specification and, together with the description, explain theadvantages and principles of exemplary embodiments of the presentdisclosure.

FIG. 1 is a diagram illustrating an exemplary moisture-resistant barrierassembly in an article or film having a vapor-depositedadhesion-promoting coating according to an exemplary embodiment of thepresent disclosure; and

FIG. 2 is a diagram illustrating an exemplary process and apparatus formaking a composite film according to an exemplary embodiment of thepresent disclosure.

Like reference numerals in the drawings indicate like elements. Thedrawings herein are not drawn to scale, and in the drawings, theillustrated elements are sized to emphasize selected features.

DETAILED DESCRIPTION Glossary

Certain terms are used throughout the description and the claims that,while for the most part are well known, may require some explanation. Itshould understood that, as used herein,

The words “a”, “an”, and “the” are used interchangeably with “at leastone” to mean one or more of the elements being described.

By using words of orientation such as “atop”, “on”, “covering”,“uppermost”, “underlying” and the like for the location of variouselements in the disclosed coated articles, we refer to the relativeposition of an element with respect to a horizontally-disposed,upwardly-facing substrate. It is not intended that the substrate orarticles should have any particular orientation in space during or aftermanufacture.

By using the term “overcoated” to describe the position of a layer withrespect to a substrate or other element of a barrier assembly in anarticle or film of the disclosure, we refer to the layer as being atopthe substrate or other element, but not necessarily contiguous to eitherthe substrate or the other element.

By using the term “separated by” to describe the position of a(co)polymer layer with respect to two inorganic barrier layers, we referto the (co)polymer layer as being between the inorganic barrier layersbut not necessarily contiguous to either inorganic barrier layer.

The terms “barrier assembly,” “barrier film” or “barrier layer” refersto an assembly, film or layer which is designed to be impervious tovapor, gas or aroma migration. Exemplary gases and vapors that may beexcluded include oxygen and/or water vapor.

The term “(meth)acrylate” with respect to a monomer, oligomer orcompound means a vinyl-functional alkyl ester formed as the reactionproduct of an alcohol with an acrylic or a methacrylic acid.

The term “polymer” or “(co)polymer” includes homopolymers andcopolymers, as well as homopolymers or copolymers that may be formed ina miscible blend, e.g., by coextrusion or by reaction, including, e.g.,transesterification. The term “copolymer” includes both random and blockcopolymers.

The term “cure” refers to a process that causes a chemical change, e.g.,a reaction via consumption of water, to solidify a film layer orincrease its viscosity.

The term “cross-linked” (co)polymer refers to a (co)polymer whose(co)polymer chains are joined together by covalent chemical bonds,usually via cross-linking molecules or groups, to form a network(co)polymer. A cross-linked (co)polymer is generally characterized byinsolubility, but may be swellable in the presence of an appropriatesolvent.

The term “cured (co)polymer” includes both cross-linked anduncross-linked (co)polymers.

The term “T_(g)” refer to the glass transition temperature of a cured(co)polymer when evaluated in bulk rather than in a thin film form. Ininstances where a (co)polymer can only be examined in thin film form,the bulk form T_(g) can usually be estimated with reasonable accuracy.Bulk form T_(g) values usually are determined by evaluating the rate ofheat flow vs. temperature using differential scanning calorimetry (DSC)to determine the onset of segmental mobility for the (co)polymer and theinflection point (usually a second-order transition) at which the(co)polymer can be said to change from a glassy to a rubbery state. Bulkform T_(g) values can also be estimated using a dynamic mechanicalthermal analysis (DMTA) technique, which measures the change in themodulus of the (co)polymer as a function of temperature and frequency ofvibration.

By using the term “visible light-transmissive” support, layer, assemblyor device, we mean that the support, layer, assembly or device has anaverage transmission over the visible portion of the spectrum, T_(vis),of at least about 20%, measured along the normal axis.

The term “metal” includes a pure metal (i.e. a metal in elemental formsuch as, for example silver, gold, platinum, and the like) or a metalalloy.

The term “vapor coating” or “vapor depositing” means applying a coatingto a substrate surface from a vapor phase, for example, by evaporatingand subsequently depositing onto the substrate surface a precursormaterial to the coating or the coating material itself. Exemplary vaporcoating processes include, for example, physical vapor deposition (PVD),chemical vapor deposition (CVD), and combinations thereof.

Various exemplary embodiments of the disclosure will now be describedwith particular reference to the Drawings. Exemplary embodiments of thepresent disclosure may take on various modifications and alterationswithout departing from the spirit and scope of the disclosure.Accordingly, it is to be understood that the embodiments of the presentdisclosure are not to be limited to the following described exemplaryembodiments, but are to be controlled by the limitations set forth inthe claims and any equivalents thereof.

Identification of a Problem to be Solved

Flexible barrier coatings or films are desirable for electronic deviceswhose components are sensitive to the ingress of water vapor. Amultilayer barrier coating or film may provide advantages over glass asit is flexible, light-weight, durable, and enables low cost continuousroll-to-roll processing.

Each of the known methods for producing a multilayer barrier coating orfilm has limitations. Chemical deposition methods (CVD and PECVD) formvaporized metal alkoxide precursors that undergo a reaction, whenadsorbed on a substrate, to form inorganic coatings. These processes aregenerally limited to low deposition rates (and consequently low linespeeds), and make inefficient use of the alkoxide precursor (much of thealkoxide vapor is not incorporated into the coating). The CVD processalso requires high substrate temperatures, often in the range of300-500° C., which may not be suitable for (co)polymer substrates.

Vacuum processes such as thermal evaporation of solid materials (e.g.,resistive heating or e-beam heating) also provide low metal oxidedeposition rates. Thermal evaporation is difficult to scale up for rollwide web applications requiring very uniform coatings (e.g., opticalcoatings) and can require substrate heating to obtain quality coatings.Additionally, evaporation/sublimation processes can require ion-assist,which is generally limited to small areas, to improve the coatingquality.

Sputtering has also been used to form metal oxide layers. While thedeposition energy of the sputter process used for forming the barrieroxide layer is generally high, the energy involved in depositing the(meth)acrylate layers is generally low. As a result the (meth)acrylatelayer typically does not have good adhesive properties with the layerbelow it, for example, an inorganic barrier oxide sub-layer. To increasethe adhesion level of the protective (meth)acrylate layer to the barrieroxide, a thin sputtered layer of silicon sub-oxide is known to be usefulin the art. If the silicon sub oxide layer is not included in the stack,the protective (meth)acrylate layer has poor initial adhesion to thebarrier oxide. The silicon sub oxide layer sputter process must becarried out with precise power and gas flow settings to maintainadhesion performance. This deposition process has historically beensusceptible to noise resulting in varied and low adhesion of theprotective (meth)acrylate layer. It is therefore desirable to eliminatethe need for a silicon sub oxide layer in the final barrier constructfor increased adhesion robustness and reduction of process complexity.

Even when the “as deposited” adhesion of the standard barrier stack isinitially acceptable, the sub oxide and protective (meth)acrylate layerhas demonstrated weakness when exposed to accelerated aging conditionsof 85° C./85% relative humidity (RH). This inter-layer weakness canresult in premature delamination of the composite film from the devicesit is intended to protect. It is desirable that the multi-layerconstruction improves upon and maintains initial adhesion levels whenaged in 85° C. and 85% RH.

One solution to this problem is to use what is referred to as a “tie”layer of particular elements such chromium, zirconium, titanium, siliconand the like, which are often sputter deposited as a mono- or thin-layerof the material either as the element or in the presence of small amountof oxygen. The tie layer element can then form chemical bonds to boththe substrate layer, an oxide, and the capping layer, a (co)polymer.

Tie layers are generally used in the vacuum coating industry to achieveadhesion between layers of differing materials. The process used todeposit the layers often requires fine tuning to achieve the right layerconcentration of tie layer atoms. The deposition can be affected byslight variations in the vacuum coating process such as fluctuation invacuum pressure, out-gassing, and cross contamination from otherprocesses resulting in variation of adhesion levels in the product. Inaddition, tie layers often do not retain their initial adhesion levelsafter exposure to water vapor. A more robust solution for adhesionimprovement in composite films is desirable.

Discovery of a Solution to the Problem

We have surprisingly discovered that a composite film comprising aprotective (co)polymer layer comprising the reaction product of at leastone diurethane (meth)acrylate-silane precursor compound as describedfurther below, improves the adhesion and moisture barrier performance ofa multilayer composite barrier assembly in an article or film. Thesemultilayer composite barrier assemblies in articles or films have anumber of applications in the photovoltaic, display, lighting, andelectronic device markets as flexible replacements for glassencapsulating materials.

In exemplary embodiments of the present disclosure, the desiredtechnical effects and solution to the technical problem to obtainimproved multilayer composite barrier assemblies in articles or barrierfilms were obtained by chemically modifying the compositions used in theprocess for applying (e.g. by vapor coating) a protective (co)polymerlayer to a multilayer composite barrier assembly in an article or filmto achieve, in some exemplary embodiments:

-   -   1) a robust chemical bond with an inorganic oxide surface,    -   2) a robust chemical bond to the (meth)acrylate coating through        (co)polymerization, and    -   3) the maintenance of some of the physical properties of the        modified molecules (e.g. boiling point, vapor pressure, and the        like) such that they can be co-evaporated with a bulk        (meth)acrylate material.        Multilayer Composite Barrier Assemblies or Films

In exemplary embodiments, the disclosure describes a multilayercomposite barrier assembly in an article or film comprising a substrate,an oxide layer on the base (co)polymer layer; and a protective(co)polymer layer on the oxide layer, the protective (co)polymer layercomprising the reaction product of at least one foregoing diurethane(meth)acrylate-silane precursor compounds of the formulaR_(A)—NH—C(O)—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S), asdescribed further below. The substrate is selected from a (co)polymericfilm or an electronic device, the electronic device further including anorganic light emitting device (OLED), an electrophoretic light emittingdevice, a liquid crystal display, a thin film transistor, a photovoltaicdevice, or a combination thereof.

As further explained below, diurethane (meth)acrylate-silane precursorcompounds according to the present disclosure can be prepared in twosteps. In the first step, a primary or secondary aminosilane is reactedwith a cyclic carbonate to yield ahydroxyalkylene-carbamoyl-alkylene-alkoxysilanes referred to as a“hydroxycarbamoylsilane”); and reacting this hydroxycarbamoylsilane witha (meth)acrylated material having isocyanate functionality, either neator in a solvent, and optionally with a catalyst, such as a tin compound,to accelerate the reaction to provide the diurethane(meth)acrylate-silane compositions of the present disclosure.

An optional inorganic layer, which preferably is an oxide layer, can beapplied over the protective (co)polymer layer. Presently preferredinorganic layers comprise at least one of silicon aluminum oxide orindium tin oxide.

Turning to the drawings, FIG. 1 is a diagram of a barrier assembly in anarticle or film 10 having a moisture resistant coating comprising asingle dyad. Film 10 includes layers arranged in the following order: asubstrate 12; a base (co)polymer layer 14; an oxide layer 16; aprotective (co)polymer layer 18; and an optional oxide layer 20. Oxidelayer 16 and protective (co)polymer layer 18 together form a dyad and,although only one dyad is shown, film 10 can include additional dyads ofalternating oxide layer 16 and protective (co)polymer layer 18 betweensubstrate 10 and the uppermost dyad.

In certain exemplary embodiments, the barrier assembly in an article orfilm comprises a plurality of alternating layers of the oxide layer andthe protective (co)polymer layer on the base (co)polymer layer. Theoxide layer and protective (co)polymer layer together form a “dyad”, andin one exemplary embodiment, the barrier assembly in an article or filmcan include more than one dyad, forming a multilayer barrier assembly inan article or film. Each of the oxide layers and/or protective(co)polymer layers in the multilayer barrier assembly in an article orfilm (i.e. including more than one dyad) can be the same or different.An optional inorganic layer, which preferably is an oxide layer, can beapplied over the plurality of alternating layers or dyads.

In some exemplary embodiments, protective (co)polymer layer 18comprising the reaction product of at least one of the foregoingdiurethane (meth)acrylate-silane precursor compounds improves themoisture resistance of film 10 and the peel strength adhesion ofprotective (co)polymer layer 18 to the underlying oxide layer, leadingto improved adhesion and delamination resistance within the furtherbarrier stack layers, as explained further below. Presently preferredmaterials for use in the barrier assembly in an article or film 10 arealso identified further below, and in the Examples.

Protective (Co)Polymer Layers

The present disclosure describes protective (co)polymer layers used incomposite barrier assemblies in articles and films (i.e. barrier films)useful in reducing oxygen and/or water vapor barrier transmission whenused as packaging materials, for example, to package electronic devices.Each protective (co)polymer layer includes in its manufacture at leastone composition of matter described herein as a diurethane(meth)acrylate-silane precursor compound, the reaction product thereofforms a (co)polymer, as described further below.

Thus, in some exemplary embodiments, the present disclosure describes abarrier assembly in an article or film including a substrate, a base(co)polymer layer on a major surface of the substrate, an oxide layer onthe base (co)polymer layer, and a protective (co)polymer layer on theoxide layer. The protective (co)polymer layer includes the reactionproduct of at least one of the foregoing diurethane(meth)acrylate-silane precursor compounds of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),as described further below.

In any of the foregoing articles, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary embodimentsof the foregoing articles, at least some of the hydrolysable groups Yare alkoxy groups.

Composite Barrier Assembly or Barrier Film Materials

The present disclosure describes protective (co)polymer layerscomprising the reaction product of at least one diurethane(meth)acrylate-silane precursor compound having the general formulaR_(A)—NH—C(O)—N(R⁴)—R¹¹—[O—C(O)NH—R_(S)]_(n), orR_(S)—NH—C(O)—N(R⁴)—R¹¹—[O—C(O)NH—R_(A)]_(n), as described furtherbelow. Among other things, (co)polymer layers comprising such reactionproduct(s) of at least one diurethane (meth)acrylate-silane precursorcompound are useful for improving the interlayer adhesion of compositebarrier assemblies used in articles or barrier films.

Diurethane (Meth)acrylate Silane Precursor Compounds

The present disclosure also describes new compositions of mattercomprising at least one diurethane (meth)acrylate-silane precursorcompound of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S).R_(A) is a (meth)acryl group containing group of the formulaR¹¹-(A)_(n), wherein R¹¹ is a polyvalent alkylene, arylene, alkarylene,or aralkylene group, said alkylene, arylene, alkarylene, or aralkylenegroups optionally containing one or more catenary oxygen atoms; A is a(meth)acryl group comprising the formula X²—C(O)—C(R³)═CH₂, furtherwherein X² is —O, —S, or —NR³, R³ is independently H, or C₁-C₄, and n=1to 5. In addition, each R¹², R¹³, R¹⁴, R¹⁵, R¹⁶, and R¹⁷ isindependently H, a linear, branched or cyclic alkyl group of 1 to 6carbon atoms, optionally including 1 to 3 catenary oxygen, sulfur, ornitrogen atoms, and optionally substituted with one or more hydroxylgroups. Furthermore, R_(S) is a silane containing group of the formula—R¹—[Si(Y_(p))(R²)_(3-p)]_(q), wherein R¹ is a polyvalent alkylene,arylene, alkarylene, or aralkylene group, said alkylene, arylene,alkarylene, or aralkylene group, optionally containing one or morecatenary oxygen atoms; Y is a hydrolysable group, R² is a monovalentalkyl or aryl group, p is 1, 2, or 3, and q is independently 1 to 5. R⁵is H, C₁ to C₆ alkyl, C₁ to C₆ cycloalkyl, or R_(S); and a is 0, 1, or2.

In any of the foregoing embodiments, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary presentlypreferred embodiments, at least some of the hydrolysable groups Y arealkoxy groups.

As further explained below, diurethane (meth)acrylate-silanes accordingto the present disclosure can be prepared in two steps. In the firststep, a primary or secondary aminosilane is reacted with a cycliccarbonate to yield a hydroxyalkylene-carbamoylalkylene-alkoxysilanesreferred to as a “hydroxycarbamoylsilane.” The following equation isillustrative:

This hydroxycarbamoylsilane is then reacted with a (meth)acrylatedmaterial having isocyanate functionality, either neat or in a solvent,and optionally with a catalyst, such as a tin compound, to acceleratethe reaction to provide the diurethane (meth)acrylate-silanecompositions of the present disclosure.

Some suitable (meth)acrylated materials having mono-isocyanatefunctionality include 3-isocyanatoethyl methacrylate, 3-isocyanatoethylmethacrylate, and 1,1-bis(acryloyloxymethyl)ethyl isocyanate.

Aminosilanes suitable for use in connection with the present inventionmay be primary or secondary. Some primary aminosilanes useful in thepractice of this invention are described in U.S. Pat. No. 4,378,250(Treadway et al.) and include aminoethyltriethoxysilane,β-aminoethyltrimethoxysilane, β-aminoethyltriethoxysilane,β-aminoethyltributoxysilane, β-aminoethyltripropoxysilane,α-amino-ethyltrimethoxysilane, α-aminoethyltriethoxysilane,γ-aminopropyltrimethoxy-silane, γ-aminopropyltriethoxysilane,γ-aminopropyltributoxysilane, γ-aminopropyltripropoxysilane,β-aminopropyltrimethoxysilane, β-aminopropyltriethoxysilane,β-aminopropyltripropoxysilane, β-aminopropyltributoxysilane,α-aminopropyltrimethoxysilane, α-aminopropyltriethoxysilane,α-aminopropyltributoxysilane, and α-aminopropyltripropoxysilane.

Some secondary aminosilanes useful in the practice of the inventioninclude N-methyl aminopropyltrimethoxysilane, N-methylaminopropyltriethoxysilane, bis(propyl-3-trimethoxysilane)amine,bis(propyl-3-triethoxysilane)amine, N-butyl aminopropyltrimethoxysilane,N-butyl aminopropyltriethoxysilane,N-cyclohexyl-aminopropyltrimethoxysilane, N-cyclohexylaminomethyltrimethoxysilane, N-cyclohexyl aminomethyltriethoxysilane,and N-cyclohexyl aminomethyldiethoxy-monomethylsilane.

In some exemplary embodiments, it will be advantageous to select asilane such as a triethoxysilane which will undergo less exchange withthe alcohol that is formed. It has been observed that trimethoxysilaneswill often undergo the alcohol-trialkoxysilane exchange to a greaterextent. Two currently preferred aminosilanes are3-aminopropyltriethoxysilane (γ-aminopropyltriethoxysilane), andbis(propyl-3-triethoxysilane)amine.

Cyclic alkylene carbonates useful in making the hydroxycarbamoylsilanesinclude ethylene carbonate, and propylene carbonate(4-methyl-1,3-dioxolan-2-one) among others. When the cyclic carbonate isnot symmetrical, a mixture of two regioisomers will usually result. Forexample, the reaction of aminopropyltriethoxysilane with propylenecarbonate, followed by reaction with isocyanatoethyl methacrylateprovides two products as regioisomers:

which can be represented as a single formula:

Other details about the formation of the hydroxycarbamoylsilanes may befound in U.S. Pat. No. 5,866,651.

While not intending to be bound by any particular theory, we currentlybelieve that the reaction products of the first step, i.e. the materialsof the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),appear to be the result of reacting each hydroxyl group of a diolselectively with a different isocyanate, one hydroxyl group reactingwith an isocyanate compound having silane functionality and one hydroxylgroup reacting with an isocyanate compound having acrylatefunctionality. A diol if reacted simultaneously or sequentially with twodifferent isocyanate materials, one with silane functionality and onewith (meth)acrylate functionality, would result in a three componentmixture of diurethane compounds respectively, with 1) only acrylategroups, 2) only silane groups, along with the desired 3) acrylate andsilane groups.

Using the two step sequence method of 1) reacting a primary or secondaryaminosilane with a cyclic carbonate to yield a hydroxycarbamoylsilanefollowed by 2) reacting the hydroxycarbamoylsilane with (meth)acrylatedmaterial having isocyanate functionality cleanly produces a diurethanematerial with silane and (meth)acrylate functionality. Thus the materialconsists of materials of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S)without significant amounts of silane only or acrylate only material.

Additional information about the preparation of urethanes can be foundin “Polyurethanes: Chemistry and Technology,” Saunders and Frisch,Interscience Publishers (New York, 1963 (Part I) and 1964 (Part II).

The molecular weights of the diurethane (meth)acrylate-silane couplingagents are in the range where sufficient vapor pressure at vacuumprocess conditions is effective to carry out evaporation and thensubsequent condensation to a thin liquid film. The molecular weights arepreferably less than about 2,000 Da, more preferably less than 1,000 Da,even more preferably less than 500 Da.

Preferably, the diurethane (meth)acrylate-silane coupling agent ispresent at no more than 20% by weight (% wt.) of the vapor coatedmixture; more preferably no more than 19%, 18%, 17%, 16%, 15%, 14%, 13%,12%, 11%, and even more preferably 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%or even 1% wt. of the vapor deposited mixture.

Substrates

The substrate 12 is selected from a (co)polymeric film or an electronicdevice, the electronic device further including an organic lightemitting device (OLED), an electrophoretic light emitting device, aliquid crystal display, a thin film transistor, a photovoltaic device,or a combination thereof.

Typically, the electronic device substrate is a moisture sensitiveelectronic device. The moisture sensitive electronic device can be, forexample, an organic, inorganic, or hybrid organic/inorganicsemiconductor device including, for example, a photovoltaic device suchas a copper indium gallium (di)selenide (CIGS) solar cell; a displaydevice such as an organic light emitting display (OLED), electrochromicdisplay, electrophoretic display, or a liquid crystal display (LCD) suchas a quantum dot LCD display; an OLED or other electroluminescent solidstate lighting device, or combinations thereof and the like.

In some exemplary embodiments, substrate 12 can be a flexible, visiblelight-transmissive substrate, such as a flexible light transmissive(co)polymeric film. In one presently preferred exemplary embodiment, thesubstrates are substantially transparent, and can have a visible lighttransmission of at least about 50%, 60%, 70%, 80%, 90% or even up toabout 100% at 550 nm.

Exemplary flexible light-transmissive substrates include thermoplastic(co)polymeric films including, for example, polyesters, polyacrylates(e.g., polymethyl methacrylate), polycarbonates, polypropylenes, high orlow density polyethylenes, polysulfones, polyether sulfones,polyurethanes, polyamides, polyvinyl butyral, polyvinyl chloride,fluoro(co)polymers (e.g., polyvinylidene difluoride andpolytetrafluoroethylene), polyethylene sulfide, and thermoset films suchas epoxies, cellulose derivatives, polyimide, polyimide benzoxazole andpolybenzoxazole.

Presently preferred (co)polymeric films comprise polyethyleneterephthalate (PET), polyethylene napthalate (PEN), heat stabilized PET,heat stabilized PEN, polyoxymethylene, polyvinylnaphthalene,polyetheretherketone, fluoro(co)polymer, polycarbonate,polymethylmethacrylate, poly α-methyl styrene, polysulfone,polyphenylene oxide, polyetherimide, polyethersulfone, polyamideimide,polyimide, polyphthalamide, or combinations thereof.

In some exemplary embodiments, the substrate can also be a multilayeroptical film (“MOF”), such as those described in U.S. Patent ApplicationPublication No. US 2004/0032658 A1. In one exemplary embodiment, thefilms can be prepared on a substrate including PET.

The (co)polymeric film can be heat-stabilized, using heat setting,annealing under tension, or other techniques that will discourageshrinkage up to at least the heat stabilization temperature when the(co)polymeric film is not constrained.

The substrate may have a variety of thicknesses, e.g., about 0.01 toabout 1 mm. The substrate may however be considerably thicker, forexample, when a self-supporting article is desired. Such articles canconveniently also be made by laminating or otherwise joining a disclosedfilm made using a flexible substrate to a thicker, inflexible or lessflexible supplemental support.

Base (Co)Polymer Layer

Returning to FIG. 1, the base (co)polymer layer 14 can include any(co)polymer suitable for deposition in a thin film. In one aspect, forexample, the base (co)polymer layer 14 can be formed from variousprecursors, for example, (meth)acrylate monomers and/or oligomers thatinclude acrylates or methacrylates such as urethane acrylates, isobornylacrylate, dipentaerythritol pentaacrylates, epoxy acrylates, epoxyacrylates blended with styrene, di-trimethylolpropane tetraacrylates,diethylene glycol diacrylates, 1,3-butylene glycol diacrylate,pentaacrylate esters, pentaerythritol tetraacrylates, pentaerythritoltriacrylates, ethoxylated (3) trimethylolpropane triacrylates,ethoxylated (3) trimethylolpropane triacrylates, alkoxylatedtrifunctional acrylate esters, dipropylene glycol diacrylates, neopentylglycol diacrylates, ethoxylated (4) bisphenol a dimethacrylates,cyclohexane dimethanol diacrylate esters, isobornyl methacrylate, cyclicdiacrylates and tris(2-hydroxy ethyl) isocyanurate triacrylate,acrylates of the foregoing methacrylates and methacrylates of theforegoing acrylates. Preferably, the base (co)polymer precursorcomprises a (meth)acrylate monomer.

The base (co)polymer layer 14 can be formed by applying a layer of amonomer or oligomer to the substrate and crosslinking the layer to formthe (co)polymer in situ, e.g., by flash evaporation and vapor depositionof a radiation-crosslinkable monomer, followed by crosslinking using,for example, an electron beam apparatus, UV light source, electricaldischarge apparatus or other suitable device. Coating efficiency can beimproved by cooling the substrate.

The monomer or oligomer can also be applied to the substrate 12 usingconventional coating methods such as roll coating (e.g., gravure rollcoating) or spray coating (e.g., electrostatic spray coating), thencrosslinked as set out above. The base (co)polymer layer 14 can also beformed by applying a layer containing an oligomer or (co)polymer insolvent and drying the thus-applied layer to remove the solvent. PlasmaEnhanced Chemical Vapor Deposition (PECVD) may also be employed in somecases.

Most preferably, the base (co)polymer layer 14 is formed by flashevaporation and vapor deposition followed by crosslinking in situ, e.g.,as described in U.S. Pat. No. 4,696,719 (Bischoff), U.S. Pat. No.4,722,515 (Ham), U.S. Pat. No. 4,842,893 (Yializis et al.), U.S. Pat.No. 4,954,371 (Yializis), U.S. Pat. No. 5,018,048 (Shaw et al.), U.S.Pat. No. 5,032,461 (Shaw et al.), U.S. Pat. No. 5,097,800 (Shaw et al.),U.S. Pat. No. 5,125,138 (Shaw et al.), U.S. Pat. No. 5,440,446 (Shaw etal.), U.S. Pat. No. 5,547,908 (Furuzawa et al.), U.S. Pat. No. 6,045,864(Lyons et al.), U.S. Pat. No. 6,231,939 (Shaw et al. and U.S. Pat. No.6,214,422 (Yializis); in PCT International Publication No. WO 00/26973(Delta V Technologies, Inc.); in D. G. Shaw and M. G. Langlois, “A NewVapor Deposition Process for Coating Paper and (co)polymer Webs”, 6thInternational Vacuum Coating Conference (1992); in D. G. Shaw and M. G.Langlois, “A New High Speed Process for Vapor Depositing Acrylate ThinFilms: An Update”, Society of Vacuum Coaters 36th Annual TechnicalConference Proceedings (1993); in D. G. Shaw and M. G. Langlois, “Use ofVapor Deposited Acrylate Coatings to Improve the Barrier Properties ofMetallized Film”, Society of Vacuum Coaters 37th Annual TechnicalConference Proceedings (1994); in D. G. Shaw, M. Roehrig, M. G. Langloisand C. Sheehan, “Use of Evaporated Acrylate Coatings to Smooth theSurface of Polyester and Polypropylene Film Substrates”, RadTech (1996);in J. Affinito, P. Martin, M. Gross, C. Coronado and E. Greenwell,“Vacuum Deposited Polymer/Metal Multilayer Films for OpticalApplication”, Thin Solid Films 270, 43-48 (1995); and in J. D. Affinito,M. E. Gross, C. A. Coronado, G. L. Graff, E. N. Greenwell and P. M.Martin, “Polymer-Oxide Transparent Barrier Layers”, Society of VacuumCoaters 39th Annual Technical Conference Proceedings (1996).

In some exemplary embodiments, the smoothness and continuity of the base(co)polymer layer 14 (and also each oxide layer 16 and protective(co)polymer layer 18) and its adhesion to the underlying substrate orlayer may be enhanced by appropriate pretreatment. Examples of asuitable pretreatment regimen include an electrical discharge in thepresence of a suitable reactive or non-reactive atmosphere (e.g.,plasma, glow discharge, corona discharge, dielectric barrier dischargeor atmospheric pressure discharge); chemical pretreatment or flamepretreatment. These pretreatments help make the surface of theunderlying layer more receptive to formation of the subsequently applied(co)polymeric (or inorganic) layer. Plasma pretreatment can beparticularly useful.

In some exemplary embodiments, a separate adhesion promotion layer whichmay have a different composition than the base (co)polymer layer 14 mayalso be used atop the substrate or an underlying layer to improveadhesion. The adhesion promotion layer can be, for example, a separate(co)polymeric layer or a metal-containing layer such as a layer ofmetal, metal oxide, metal nitride or metal oxynitride. The adhesionpromotion layer may have a thickness of a few nm (e.g., 1 or 2 nm) toabout 50 nm, and can be thicker if desired.

The desired chemical composition and thickness of the base (co)polymerlayer will depend in part on the nature and surface topography of thesubstrate. The thickness preferably is sufficient to provide a smooth,defect-free surface to which the subsequent oxide layer can be applied.For example, the base (co)polymer layer may have a thickness of a few nm(e.g., 2 or 3 nm) to about 5 micrometers, and can be thicker if desired.

In another aspect, the barrier assembly includes a substrate selectedfrom a (co)polymer film and a moisture sensitive device, and the barrierlayers are disposed on or adjacent to the substrate. As describedfurther below, the barrier assembly can be deposited directly on a(co)polymer film substrate, or a substrate that includes a moisturesensitive device, a process often referred to as direct deposition ordirect encapsulation. Exemplary direct deposition processes and barrierassemblies or described in U.S. Pat. No. 5,654,084 (Affinito); U.S. Pat.No. 6,522,067 (Graff et al.); U.S. Pat. No. 6,548,912 (Graff et al.);U.S. Pat. No. 6,573,652 (Graff et al.); and U.S. Pat. No. 6,835,950(Brown et al.).

In some exemplary embodiments, flexible electronic devices can beencapsulated directly with the methods described herein. For example,the devices can be attached to a flexible carrier substrate, and a maskcan be deposited to protect electrical connections from the inorganiclayer(s), (co)polymer layer(s), or other layer(s)s during theirdeposition. The inorganic layer(s), (co)polymeric layer(s), and otherlayer(s) making up the multilayer barrier assembly can be deposited asdescribed elsewhere in this disclosure, and the mask can then beremoved, exposing the electrical connections.

In one exemplary direct deposition or direct encapsulation embodiment,the moisture sensitive device is a moisture sensitive electronic device.The moisture sensitive electronic device can be, for example, anorganic, inorganic, or hybrid organic/inorganic semiconductor deviceincluding, for example, a photovoltaic device such as a copper indiumgallium (di)selenide (CIGS) solar cell; a display device such as anorganic light emitting display (OLED), electrochromic display,electrophoretic display, or a liquid crystal display (LCD) such as aquantum dot LCD display; an OLED or other electroluminescent solid statelighting device, or combinations thereof and the like.

Examples of suitable processes for making a multilayer barrier assemblyand suitable transparent multilayer barrier coatings can be found, forexample, in U.S. Pat. No. 5,440,446 (Shaw et al.); U.S. Pat. No.5,877,895 (Shaw et al.); U.S. Pat. No. 6,010,751 (Shaw et al.); and U.S.Pat. No. 7,018,713 (Padiyath et al.). In one presently preferredembodiment, the barrier assembly in an article or film can be fabricatedby deposition of the various layers onto the substrate, in aroll-to-roll vacuum chamber similar to the system described in U.S. Pat.No. 5,440,446 (Shaw et al.) and U.S. Pat. No. 7,018,713 (Padiyath, etal.).

It is presently preferred that the base polymer layer 14 is formed byflash evaporation and vapor deposition followed by crosslinking in situ,e.g., as described in U.S. Pat. No. 4,696,719 (Bischoff), U.S. Pat. No.4,722,515 (Ham), U.S. Pat. No. 4,842,893 (Yializis et al.), U.S. Pat.No. 4,954,371 (Yializis), U.S. Pat. No. 5,018,048 (Shaw et al.), U.S.Pat. No. 5,032,461 (Shaw et al.), U.S. Pat. No. 5,097,800 (Shaw et al.),U.S. Pat. No. 5,125,138 (Shaw et al.), U.S. Pat. No. 5,440,446 (Shaw etal.), U.S. Pat. No. 5,547,908 (Furuzawa et al.), U.S. Pat. No. 6,045,864(Lyons et al.), U.S. Pat. No. 6,231,939 (Shaw et al. and U.S. Pat. No.6,214,422 (Yializis); and in PCT International Publication No. WO00/26973 (Delta V Technologies, Inc.).

Oxide Layers

The improved barrier assembly in an article or film includes at leastone oxide layer 16. The oxide layer preferably comprises at least oneinorganic material. Suitable inorganic materials include oxides,nitrides, carbides or borides of different atomic elements. Presentlypreferred inorganic materials included in the oxide layer compriseoxides, nitrides, carbides or borides of atomic elements from Groups HA,IIIA, IVA, VA, VIA, VIIA, IB, or IIB, metals of Groups IIIB, IVB, or VB,rare-earth metals, or combinations thereof. In some particular exemplaryembodiments, an inorganic layer, more preferably an inorganic oxidelayer, may be applied to the uppermost protective (co)polymer layer.Preferably, the oxide layer comprises silicon aluminum oxide or indiumtin oxide.

In some exemplary embodiments, the composition of the oxide layer maychange in the thickness direction of the layer, i.e. a gradientcomposition. In such exemplary embodiments, the oxide layer preferablyincludes at least two inorganic materials, and the ratio of the twoinorganic materials changes throughout the thickness of the oxide layer.The ratio of two inorganic materials refers to the relative proportionsof each of the inorganic materials. The ratio can be, for example, amass ratio, a volume ratio, a concentration ratio, a molar ratio, asurface area ratio, or an atomic ratio.

The resulting gradient oxide layer is an improvement over homogeneous,single component layers. Additional benefits in barrier and opticalproperties can also be realized when combined with thin, vacuumdeposited protective (co)polymer layers. A multilayer gradientinorganic-(co)polymer barrier stack can be made to enhance opticalproperties as well as barrier properties.

The barrier assembly in an article or film can be fabricated bydeposition of the various layers onto the substrate, in a roll-to-rollvacuum chamber similar to the system described in U.S. Pat. No.5,440,446 (Shaw et al.) and U.S. Pat. No. 7,018,713 (Padiyath, et al.).The deposition of the layers can be in-line, and in a single passthrough the system. In some cases, the barrier assembly in an article orfilm can pass through the system several times, to form a multilayerbarrier assembly in an article or film having several dyads.

The first and second inorganic materials can be oxides, nitrides,carbides or borides of metal or nonmetal atomic elements, orcombinations of metal or nonmetal atomic elements. By “metal ornonmetal” atomic elements is meant atomic elements selected from theperiodic table Groups HA, IIIA, IVA, VA, VIA, VIIA, IB, or IIB, metalsof Groups IIIB, IVB, or VB, rare-earth metals, or combinations thereof.Suitable inorganic materials include, for example, metal oxides, metalnitrides, metal carbides, metal oxynitrides, metal oxyborides, andcombinations thereof, e.g., silicon oxides such as silica, aluminumoxides such as alumina, titanium oxides such as titania, indium oxides,tin oxides, indium tin oxide (“ITO”), tantalum oxide, zirconium oxide,niobium oxide, aluminum nitride, silicon nitride, boron nitride,aluminum oxynitride, silicon oxynitride, boron oxynitride, zirconiumoxyboride, titanium oxyboride, and combinations thereof. ITO is anexample of a special class of ceramic materials that can becomeelectrically conducting with the proper selection of the relativeproportions of each elemental constituent. Silicon-aluminum oxide andindium tin oxide are presently preferred inorganic materials forming theoxide layer 16.

For purposes of clarity, the oxide layer 16 described in the followingdiscussion is directed toward a composition of oxides; however, it is tobe understood that the composition can include any of the oxides,nitrides, carbides, borides, oxynitrides, oxyborides and the likedescribed above.

In one embodiment of the oxide layer 16, the first inorganic material issilicon oxide, and the second inorganic material is aluminum oxide. Inthis embodiment, the atomic ratio of silicon to aluminum changesthroughout the thickness of the oxide layer, e.g., there is more siliconthan aluminum near a first surface of the oxide layer, graduallybecoming more aluminum than silicon as the distance from the firstsurface increases. In one embodiment, the atomic ratio of silicon toaluminum can change monotonically as the distance from the first surfaceincreases, i.e., the ratio either increases or decreases as the distancefrom the first surface increases, but the ratio does not both increaseand decrease as the distance from the first surface increases. Inanother embodiment, the ratio does not increase or decreasemonotonically, i.e. the ratio can increase in a first portion, anddecrease in a second portion, as the distance from the first surfaceincreases. In this embodiment, there can be several increases anddecreases in the ratio as the distance from the first surface increases,and the ratio is non-monotonic. A change in the inorganic oxideconcentration from one oxide species to another throughout the thicknessof the oxide layer 16 results in improved barrier performance, asmeasured by water vapor transmission rate.

In addition to improved barrier properties, the gradient composition canbe made to exhibit other unique optical properties while retainingimproved barrier properties. The gradient change in composition of thelayer produces corresponding change in refractive index through thelayer. The materials can be chosen such that the refractive index canchange from high to low, or vice versa. For example, going from a highrefractive index to a low refractive index can allow light traveling inone direction to easily pass through the layer, while light travellingin the opposite direction may be reflected by the layer. The refractiveindex change can be used to design layers to enhance light extractionfrom a light emitting device being protected by the layer. Therefractive index change can instead be used to pass light through thelayer and into a light harvesting device such as a solar cell. Otheroptical constructions, such as band pass filters, can also beincorporated into the layer while retaining improved barrier properties.

In order to promote silane bonding to the oxide surface, it may bedesirable to form hydroxyl silanol (Si—OH) groups on a freshly sputterdeposited silicon dioxide (SiO₂) layer. The amount of water vaporpresent in a multi-process vacuum chamber can be controlled sufficientlyto promote the formation of Si—OH groups in high enough surfaceconcentration to provide increased bonding sites. With residual gasmonitoring and the use of water vapor sources the amount of water vaporin a vacuum chamber can be controlled to ensure adequate generation ofSi—OH groups.

Process for Making Articles Including Barrier Assemblies or BarrierFilms

In other exemplary embodiments, the disclosure describes a process, e.g.for making a barrier film on a (co)polymer film substrate or for makingan article by depositing a multilayer composite barrier assembly on anelectronic device substrate, the process including: (a) applying a base(co)polymer layer to a major surface of a substrate, (b) applying anoxide layer on the base (co)polymer layer, and (c) depositing on theoxide layer a protective (co)polymer layer, wherein the protective(co)polymer layer includes a (co)polymer formed as the reaction productof at least one of the foregoing diurethane (meth)acrylate-silaneprecursor compound of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷]_(a)—O—C(O)—N(R⁵)—R_(S),as described above. The substrate is selected from a (co)polymeric filmor an electronic device, the electronic device further including anorganic light emitting device (OLED), an electrophoretic light emittingdevice, a liquid crystal display, a thin film transistor, a photovoltaicdevice, or a combination thereof.

In some exemplary embodiments of the process, the at least onediurethane (meth)acrylate-silane precursor compound undergoes a chemicalreaction to form the protective (co)polymer layer at least in part onthe oxide layer. Optionally, the chemical reaction is selected from afree radical polymerization reaction, and a hydrolysis reaction.

In any of the foregoing articles, each hydrolysable group Y isindependently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen. In some particular exemplary embodimentsof the foregoing articles, at least some of the hydrolysable groups Yare alkoxy.

In some particular exemplary embodiments of any of the foregoingprocesses, step (a) comprises: (i) evaporating a base (co)polymerprecursor, (ii) condensing the evaporated base (co)polymer precursoronto the substrate, and (iii) curing the evaporated base (co)polymerprecursor to form the base (co)polymer layer. In certain such exemplaryembodiments, the base (co)polymer precursor includes a (meth)acrylatemonomer.

In certain particular exemplary embodiments of any of the foregoingprocesses, step (b) comprises depositing an oxide onto the base(co)polymer layer to form the oxide layer. Depositing is achieved usingsputter deposition, reactive sputtering, chemical vapor deposition, or acombination thereof. In some particular exemplary embodiments of any ofthe foregoing processes, step (b) comprises applying a layer of aninorganic silicon aluminum oxide to the base (co)polymer layer. Infurther exemplary embodiments of any of the foregoing processes, theprocess further comprises sequentially repeating steps (b) and (c) toform a multiplicity of alternating layers of the protective (co)polymerlayer and the oxide layer on the base (co)polymer layer.

In additional exemplary embodiments of any of the foregoing processes,step (c) further comprises at least one of co-evaporating the at leastone diurethane (meth)acrylate-silane precursor compound with a(meth)acrylate compound from a liquid mixture, or sequentiallyevaporating the at least one diurethane (meth)acrylate-silane precursorcompound and a (meth)acrylate compound from separate liquid sources.Optionally, the liquid mixture comprises no more than about 10 wt. % ofthe diurethane (meth)acrylate-silane precursor compound. In furtherexemplary embodiments of such processes, step (c) further comprises atleast one of co-condensing the diurethane (meth)acrylate-silaneprecursor compound with the (meth)acrylate compound onto the oxidelayer, or sequentially condensing the diurethane (meth)acrylate-silaneprecursor compound and the (meth)acrylate compound on the oxide layer.

In further exemplary embodiments of any of the foregoing processes,reacting the diurethane (meth)acrylate-silane precursor compound withthe (meth)acrylate compound to form a protective (co)polymer layer onthe oxide layer occurs at least in part on the oxide layer.

In another presently preferred exemplary embodiment, the disclosuredescribes a process for making a barrier film, the process comprising:(a) vapor depositing and curing a base (co)polymer layer onto a majorsurface of a (co)polymer film substrate; (b) vapor depositing an oxidelayer on the base (co)polymer layer; and (c) vapor depositing and curingonto the oxide layer a protective (co)polymer layer, the protective(co)polymer layer comprising a (co)polymer formed as the reactionproduct of at least one of the foregoing diurethane(meth)acrylate-silane precursor compounds of the formulaR_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),as previously described.

The vapor deposition process is generally limited to compositions thatare pumpable (liquid-phase with an acceptable viscosity); that can beatomized (form small droplets of liquid), flash evaporated (high enoughvapor pressure under vacuum conditions), condensable (vapor pressure,molecular weight), and can be cross-linked in vacuum (molecular weightrange, reactivity, functionality).

FIG. 2 is a diagram of a system 22, illustrating a process for makingbarrier assembly in an article or film 10. System 22 is contained withinan inert environment and includes a chilled drum 24 for receiving andmoving the substrate 12 (FIG. 1), as represented by a film 26, therebyproviding a moving web on which to form the barrier layers. Preferably,an optional nitrogen plasma treatment unit 40 may be used to plasmatreat or prime film 26 in order to improve adhesion of the base(co)polymer layer 14 (FIG. 1) to substrate 12 (FIG. 1). An evaporator 28applies a base (co)polymer precursor, which is cured by curing unit 30to form base (co)polymer layer 14 (FIG. 1) as drum 24 advances the film26 in a direction shown by arrow 25. An oxide sputter unit 32 applies anoxide to form layer 16 (FIG. 1) as drum 24 advances film 26.

For additional alternating oxide layers 16 and protective (co)polymerlayers 18, drum 24 can rotate in a reverse direction opposite arrow 25and then advance film 26 again to apply the additional alternating base(co)polymer and oxide layers, and that sub-process can be repeated foras many alternating layers as desired or needed. Once the base(co)polymer and oxide are complete, drum 24 further advances the film,and evaporator 36 deposits on oxide layer 16, the urea(multi)-(meth)acrylate (multi)-silane compound (as described above),which is reacted or cured to form protective (co)polymer layer 18 (FIG.1). In certain presently preferred embodiments, reacting the urea(multi)-(meth)acrylate (multi)-silane compound to form a protective(co)polymer layer 18 on the oxide layer 16 occurs at least in part onthe oxide layer 16.

Optional evaporator 34 may be used additionally to provide otherco-reactants or co-monomers (e.g., additional protective (co)polymercompounds) which may be useful in forming the protective (co)polymerlayer 18 (FIG. 1). For additional alternating oxide layers 16 andprotective (co)polymer layers 18, drum 24 can rotate in a reversedirection opposite arrow 25 and then advance film 26 again to apply theadditional alternating oxide layers 16 and protective (co)polymer layers18, and that sub-process can be repeated for as many alternating layersor dyads as desired or needed.

The oxide layer 16 can be formed using techniques employed in the filmmetalizing art such as sputtering (e.g., cathode or planar magnetronsputtering), evaporation (e.g., resistive or electron beam evaporation),chemical vapor deposition, plating and the like. In one aspect, theoxide layer 16 is formed using sputtering, e.g., reactive sputtering.Enhanced barrier properties have been observed when the oxide layer isformed by a high energy deposition technique such as sputtering comparedto lower energy techniques such as conventional chemical vapordeposition processes. Without being bound by theory, it is believed thatthe enhanced properties are due to the condensing species arriving atthe substrate with greater kinetic energy as occurs in sputtering,leading to a lower void fraction as a result of compaction.

In some exemplary embodiments, the sputter deposition process can usedual targets powered by an alternating current (AC) power supply in thepresence of a gaseous atmosphere having inert and reactive gasses, forexample argon and oxygen, respectively. The AC power supply alternatesthe polarity to each of the dual targets such that for half of the ACcycle one target is the cathode and the other target is the anode. Onthe next cycle the polarity switches between the dual targets. Thisswitching occurs at a set frequency, for example about 40 kHz, althoughother frequencies can be used. Oxygen that is introduced into theprocess forms oxide layers on both the substrate receiving the inorganiccomposition, and also on the surface of the target. The dielectricoxides can become charged during sputtering, thereby disrupting thesputter deposition process. Polarity switching can neutralize thesurface material being sputtered from the targets, and can provideuniformity and better control of the deposited material.

In further exemplary embodiments, each of the targets used for dual ACsputtering can include a single metal or nonmetal element, or a mixtureof metal and/or nonmetal elements. A first portion of the oxide layerclosest to the moving substrate is deposited using the first set ofsputtering targets. The substrate then moves proximate the second set ofsputtering targets and a second portion of the oxide layer is depositedon top of the first portion using the second set of sputtering targets.The composition of the oxide layer changes in the thickness directionthrough the layer.

In additional exemplary embodiments, the sputter deposition process canuse targets powered by direct current (DC) power supplies in thepresence of a gaseous atmosphere having inert and reactive gasses, forexample argon and oxygen, respectively. The DC power supplies supplypower (e.g. pulsed power) to each cathode target independent of theother power supplies. In this aspect, each individual cathode target andthe corresponding material can be sputtered at differing levels ofpower, providing additional control of composition through the layerthickness. The pulsing aspect of the DC power supplies is similar to thefrequency aspect in AC sputtering, allowing control of high ratesputtering in the presence of reactive gas species such as oxygen.Pulsing DC power supplies allow control of polarity switching, canneutralize the surface material being sputtered from the targets, andcan provide uniformity and better control of the deposited material.

In one particular exemplary embodiment, improved control duringsputtering can be achieved by using a mixture, or atomic composition, ofelements in each target, for example a target may include a mixture ofaluminum and silicon. In another embodiment, the relative proportions ofthe elements in each of the targets can be different, to readily providefor a varying atomic ratio throughout the oxide layer. In oneembodiment, for example, a first set of dual AC sputtering targets mayinclude a 90/10 mixture of silicon and aluminum, and a second set ofdual AC sputtering targets may include a 75/25 mixture of aluminum andsilicon. In this embodiment, a first portion of the oxide layer can bedeposited with the 90% Si/10% Al target, and a second portion can bedeposited with the 75% Al/25% Si target. The resulting oxide layer has agradient composition that changes from about 90% Si to about 25% Si (andconversely from about 10% Al to about 75% Al) through the thickness ofthe oxide layer.

In typical dual AC sputtering, homogeneous oxide layers are formed, andbarrier performance from these homogeneous oxide layers suffer due todefects in the layer at the micro and nano-scale. One cause of thesesmall scale defects is inherently due to the way the oxide grows intograin boundary structures, which then propagate through the thickness ofthe film.

Without wishing to be bound by any particular theory, it is currentlybelieved that several effects contribute to the improved barrierproperties of the gradient composition barriers described herein. Oneeffect can be that greater densification of the mixed oxides occurs inthe gradient region, and any paths that water vapor could take throughthe oxide are blocked by this densification. Another effect can be thatby varying the composition of the oxide materials, grain boundaryformation can be disrupted resulting in a microstructure of the filmthat also varies through the thickness of the oxide layer. Anothereffect can be that the concentration of one oxide gradually decreases asthe other oxide concentration increases through the thickness, reducingthe probability of forming small-scale defect sites. The reduction ofdefect sites can result in a coating having reduced transmission ratesof water permeation.

In some exemplary embodiments, exemplary films can be subjected topost-treatments such as heat treatment, ultraviolet (UV) or vacuum UV(VUV) treatment, or plasma treatment. Heat treatment can be conducted bypassing the film through an oven or directly heating the film in thecoating apparatus, e.g., using infrared heaters or heating directly on adrum. Heat treatment may for example be performed at temperatures fromabout 30° C. to about 200° C., about 35° C. to about 150° C., or about40° C. to about 70° C.

Other functional layers or coatings that can be added to the inorganicor hybrid film include an optional layer or layers to make the film morerigid. The uppermost layer of the film is optionally a suitableprotective layer, such as optional inorganic layer 20. If desired, theprotective layer can be applied using conventional coating methods suchas roll coating (e.g., gravure roll coating) or spray coating (e.g.,electrostatic spray coating), then cross-linked using, for example, UVradiation. The protective layer can also be formed by flash evaporation,vapor deposition and cross-linking of a monomer as described above.Volatilizable (meth)acrylate monomers are suitable for use in such aprotective layer. In a specific embodiment, volatilizable (meth)acrylatemonomers are employed.

Methods of Using Barrier Films

In a further aspect, the disclosure describes methods of using a barrierfilm made as described above in an article selected from a solid statelighting device, a display device, and combinations thereof. Exemplarysolid state lighting devices include semiconductor light-emitting diodes(SLEDs, more commonly known as LEDs), organic light-emitting diodes(OLEDs), or polymer light-emitting diodes (PLEDs). Exemplary displaydevices include liquid crystal displays, OLED displays, and quantum dotdisplays.

Exemplary LEDs are described in U.S. Pat. No. 8,129,205. Exemplary OLEDsare described in U.S. Pat. Nos. 8,193,698 and 8,221,176. Exemplary PLEDsare described in U.S. Pat. No. 7,943,062

Unexpected Results and Advantages

Exemplary barrier assemblies in articles or films of the presentdisclosure have a number of applications and advantages in the display,lighting, and electronic device markets as flexible replacements forglass encapsulating materials. Thus, certain exemplary embodiments ofthe present disclosure provide barrier assemblies in articles or filmswhich exhibit improved moisture resistance when used in moisture barrierapplications. In some exemplary embodiments, the barrier assembly can bedeposited directly on a substrate that includes a moisture sensitivedevice, a process often referred to as direct encapsulation.

The moisture sensitive device can be a moisture sensitive electronicdevice, for example, an organic, inorganic, or hybrid organic/inorganicsemiconductor device including, for example, a photovoltaic device suchas a CIGS; a display device such as an OLED, electrochromic, or anelectrophoretic display; an OLED or other electroluminescent solid statelighting device, or others. Flexible electronic devices can beencapsulated directly with the gradient composition oxide layer. Forexample, the devices can be attached to a flexible carrier substrate,and a mask can be deposited to protect electrical connections from theoxide layer deposition. A base (co)polymer layer and the oxide layer canbe deposited as described above, and the mask can then be removed,exposing the electrical connections.

Exemplary embodiments of the disclosed methods can enable the formationof barrier assemblies in articles or films that exhibit superiormechanical properties such as elasticity and flexibility yet still havelow oxygen or water vapor transmission rates. The barrier assemblieshave at least one inorganic or hybrid organic/oxide layer or can haveadditional inorganic or hybrid organic/oxide layers. In one embodiment,the disclosed barrier assemblies can have inorganic or hybrid layersalternating with organic compound, e.g., (co)polymer layers. In anotherembodiment, the barrier assemblies can have a film that includes aninorganic or hybrid material and an organic compound. Substrates havinga barrier assembly formed using the disclosed method can have an oxygentransmission rate (OTR) less than about 1 cc/m²-day, less than about 0.5cc/m²-day, or less than about 0.1 cc/m²-day. Substrates having a barrierassembly formed using the disclosed method can have an water vaportransmission rate (WVTR) less than about 10 cc/m²-day, less than about 5cc/m²-day, or less than about 1 cc/m²-day.

Exemplary embodiments of barrier assemblies in articles and barrierfilms according to the present disclosure are preferably transmissive toboth visible and infrared light. The term “transmissive to visible andinfrared light” as used herein can mean having an average transmissionover the visible and infrared portion of the spectrum of at least about75% (in some embodiments at least about 80, 85, 90, 92, 95, 97, or 98%)measured along the normal axis. In some embodiments, the visible andinfrared light-transmissive assembly has an average transmission over arange of 400 nm to 1400 nm of at least about 75% (in some embodiments atleast about 80, 85, 90, 92, 95, 97, or 98%). Visible and infraredlight-transmissive assemblies are those that do not interfere withabsorption of visible and infrared light, for example, by photovoltaiccells. In some embodiments, the visible and infrared light-transmissiveassembly has an average transmission over a range wavelengths of lightthat are useful to a photovoltaic cell of at least about 75% (in someembodiments at least about 80, 85, 90, 92, 95, 97, or 98%). The firstand second (co)polymeric film substrates, pressure sensitive adhesivelayer, and barrier film can be selected based on refractive index andthickness to enhance transmission to visible and infrared light.

Exemplary embodiments of barrier assemblies in articles and barrierfilms according to the present disclosure are typically flexible. Theterm “flexible” as used herein with respect to a barrier film refers tobeing capable of being formed into a roll. In some barrier filmembodiments, the term “flexible” refers to being capable of being bentaround a roll core with a radius of curvature of up to 7.6 centimeters(cm) (3 inches), in some embodiments up to 6.4 cm (2.5 inches), 5 cm (2inches), 3.8 cm (1.5 inch), or 2.5 cm (1 inch). In some embodiments, theflexible assembly can be bent around a radius of curvature of at least0.635 cm (¼ inch), 1.3 cm (½ inch) or 1.9 cm (¾ inch).

Exemplary barrier assemblies in articles and barrier films according tothe present disclosure generally do not exhibit delamination or curlthat can arise from thermal stresses or shrinkage in a multilayerstructure. Herein, curl is measured for barrier films using a curl gaugedescribed in “Measurement of Web Curl” by Ronald P. Swanson presented inthe 2006 AWEB conference proceedings (Association of IndustrialMetallizers, Coaters and Laminators, Applied Web Handling ConferenceProceedings, 2006). According to this method curl can be measured to theresolution of 0.25 m⁻¹ curvature. In some embodiments, barrier filmsaccording to the present disclosure exhibit curls of up to 7, 6, 5, 4,or 3 m⁻¹. From solid mechanics, the curvature of a beam is known to beproportional to the bending moment applied to it. The magnitude ofbending stress is in turn is known to be proportional to the bendingmoment. From these relations the curl of a sample can be used to comparethe residual stress in relative terms.

Barrier films also typically exhibit high peel adhesion to EVA, andother common encapsulants for photovoltaics, cured on a substrate. Theproperties of the barrier films disclosed herein typically aremaintained even after high temperature and humidity aging.

Exemplary embodiments of the present disclosure have been describedabove and are further illustrated below by way of the followingExamples, which are not to be construed in any way as imposinglimitations upon the scope of the present disclosure. On the contrary,it is to be clearly understood that resort may be had to various otherembodiments, modifications, and equivalents thereof which, after readingthe description herein, may suggest themselves to those skilled in theart without departing from the spirit of the present disclosure and/orthe scope of the appended claims.

EXAMPLES

The following examples are intended to illustrate exemplary embodimentswithin the scope of this disclosure. Notwithstanding that the numericalranges and parameters setting forth the broad scope of the disclosureare approximations, the numerical values set forth in the specificexamples are reported as precisely as possible. Any numerical value,however, inherently contains certain errors necessarily resulting fromthe standard deviation found in their respective testing measurements.At the very least, and not as an attempt to limit the application of thedoctrine of equivalents to the scope of the claims, each numericalparameter should at least be construed in light of the number ofreported significant digits and by applying ordinary roundingtechniques.

Materials

The following materials, abbreviations, and trade names are used in theExamples:

90% Si/10% Al targets were obtained from Materion Advanced Chemicals,Inc. (Albuquerque, N. Mex.).

ETFE film: Ethylene-tetrafluoroethylene film available from St. GobainPerformance Plastics (Wayne, N.J.) under the trade name “NORTON® ETFE.”

Table 1 lists the materials used to prepare (multi) (meth)acrylate(multi) silane compounds according to the foregoing disclosure:

TABLE 1 Materials Used in the Examples Trade Name or Material TypeAcronym Description (Meth)acrylated BEI 1,1-bis(acryloyloxymethyl) ethylisocya- material w/ nate available from CBC America Corp. isocyanate(Commack, NY) functionality (Meth)acrylated IEA Isocyanatoethyl acrylateavailable material w/ from CBC America Corp. (Commack, isocyanate NY)functionality (Meth)acrylated IEM Isocyanatoethyl methacrylate availablematerial w/ from CBC America Corp. (Commack, isocyanate NY)functionality Cyclic carbonate PC Propylene carbonate available fromAlfa Aesar (Ward Hill, MA) Cyclic carbonate EC Ethylene carbonateavailable from Sigma Aldrich (Milwaukee, WI) Catalyst DBTDL Dibutyltindilaurate available from Sigma Aldrich (Milwaukee, WI) Solvent MEKMethyl ethyl ketone available from EMD Chemicals, Inc. Amino-functionalDynasylan 3-Aminopropyltrimethoxysilane available silane AMMO fromEvonik, Inc. (Piscataway, NJ) Amino-functional Dynasylan3-Aminopropyltriethoxysilane available silane AMEO from Evonik, Inc.(Piscataway, NJ) Amino-functional Dynasylanbis-(3-triethoxysilylpropyl)amine available silane 1122 from Evonik,Inc. (Piscataway, NJ) Amino-functional —N-methyl-3-aminopropyltrimethoxysilane silane available from SynQuestLabs, Inc. (Alachua, FL)

Solvents and other reagents used were obtained from Sigma-AldrichChemical Company (Milwaukee, Wis.), unless otherwise specified.

Synthesis of Diurethane (Meth)Acrylate-Silane Precursor CompoundsPreparative Example 1

A 250 mL round bottom flask was charged with 23.06 g (0.2259 mol) ofpropylene carbonate and 102 microliters of a 10% solution of dibutyltindilaurate (DBTDL) in methyl ethyl ketone (500 ppm DBTDL), and placed ina 55° C. oil bath. Using a pressure equalizing dropping funnel, 50.0 g(0.2259 mol) of aminopropyltriethoxysilane (Dynasylan AMEO) was addedover the course of 10 min. Heating was continued for 2 hours to providea mixture of (EtO)₃Si—(CH₂)₃—NH—C(O)—O—CH₂CH(CH₃)—OH and(EtO)₃Si—(CH₂)₃—NH—C(O)—O—CH(CH₃)CH₂—OH.

A fresh 250 ml, round bottom flask was charged with 32.27 g (0.221 mol)of isocyanatoethyl methacrylate (IEM) and 1244 microliters of a 10%solution of DBTDL in methyl ethyl ketone (1000 ppm of additional DBTDL)and placed in a 55° C. oil bath. To the flask was added 71.45 g (0.221mol) of the mixture described above over the course of 30 min. Heatingwas continued for 1.5 hours of additional reaction time. A sample wasthen taken for fourier transform infrared (FTIR) spectroscopic analysis,with the sample showing no isocyanate peak at 2265 cm⁻¹:

Preparative Example 2

An experiment was run similar to Preparative Example 1, except that, inthe first reaction, 19.89 g (0.2259 mol) of ethylene carbonate wasreacted with 50.0 g (0.2259 mol) of aminopropyltriethoxysilane(Dynasylan AMEO), and except that no DBTDL solution was added. Acarbamate alcohol was formed.

A second reaction was run similar to the second reaction of Example 1except that 67.37 g (0.2177 mol) of the carbamate alcohol was thenreacted with 33.78 g (0.2177 mol) of isocyanatoethyl methacrylate (IEM)and about 1000 ppm DBTDL to provide the product:

Preparative Example 3

A 250 mL round bottom flask was charged with 8.79 g (0.086 mol) ofpropylene carbonate and 300 ppm of DBTDL in MEK solution and placed in a55° C. oil bath. Using a pressure equalizing dropping funnel, 19.06 g(0.086 mol) of aminopropyltriethoxysilane (Dynasylan AMEO) was addedover the course of 10 min. Heating was continued for 6 hours to providea mixture of (EtO)₃Si—(CH₂)₃—NH—C(O)—O—CH₂CH(CH₃)—OH and(EtO)₃Si—(CH₂)₃—NH—C(O)—O—CH(CH₃)CH₂—OH.

An additional 1000 ppm DBTDL was added to the flask. Using an additionfunnel, 12.15 g (0.086 mol) IEA was added to the reaction over 10 min.After 2 hours additional reaction time, FTIR analysis showed noisocyanate peak, and the product was isolated as a thick whitish paste:

Preparative Example 4

An experiment was run similar to Preparative Example 3, except that, inthe first reaction 7.82 g (0.089 mol) of ethylene carbonate was reactedwith 19.65 g (0.089 mol) of aminopropyltriethoxysilane (Dynasylan AMEO)in the presence of 300 ppm DBTDL to provide a carbamate alcohol.

Similarly to Preparatory Example 3, an additional 1000 ppm DBTDL wasadded to the flask. Using an addition funnel, 12.53 g (0.089 mol) of IEAwas added to the reaction over 10 min. The following product wasobtained:

Preparative Example 5

A 250 mL roundbottom equipped with overhead stirrer was charged with23.08 g (0.226 mol) of propylene carbonate. The flask was then furthercharged with 430 microliters (about 5640 ppm) of DBTDL in MEK solution,and placed under dry air at 55° C. A dry dropping funnel was rinsed withaminopropyltriethoxysilane (Dynasylan AMEO) and material was allowed todrain through the funnel by gravity. The funnel was then tared and andused to charge the flask with 50.00 g (0.226 mol) ofaminopropyl-trimethoxysilane, which was added to the reaction over 11minutes. After 1 hour of total reaction time (including addition), thereaction was sampled for proton NMR analysis, whereupon it was foundthat the reaction was incomplete. The flask was placed in a refrigeratorovernight. In the morning, the reaction was heated for 4 hours at 55°C., at which time the NMR analysis was performed again. This time theresults revealed that the reaction was it was substantially complete.

About half of the product was removed from the flask, leaving 35.05 g(0.108 mol) of the propylene carbonate-aminopropyltrimethoxysilanecarbamate alcohol adduct in the flask. An additional 150 microliters ofDBTDL solution was added to the flask. A dry dropping funnel was rinsedwith 1,1-bis(acryloyloxymethyl)ethyl isocyanate (BEI) and this materialwas allowed to drain through the funnel by gravity. The funnel was thentared and used to further charge the flask with 25.89 g (0.108 mol) ofBEI which was added to the reaction over about 10 minutes. After 8 hoursof reaction at 55° C. and standing at to room temperature for 12 hour,FTIR analysis showed no isocyanate peak, proving the product:

The structure indicates that the material is a mixture of products, witha methyl group located on either of the carbons between the two oxygenatoms separated by the hash mark.

Preparative Example 6

A 100 mL roundbottom equipped with overhead stirrer was charged with 8.0g (0.078 mol) propylene carbonate and 97 microliters of a solution ofDBTDL in MEK solution (providing 2353 ppm of DBTDL). The flask wasplaced in a 50° C. oil bath under dry air. Via an addition funnel, 33.36g (0.078 mol) of bis(3-trimethoxysilylpropyl)amine was added over about15 minutes, to provide a urethane alcohol disilane in the form of ayellow clear liquid.

After 3.5 hours of additional reaction time, the flask was furthercharged with 36 microliters of the DBTDL, and 26.02 g (0.078 mol) of IEAwas added to the flask over the course of about 15 min. The temperaturewas reduced to 40° C. overnight, and after that time FTIR analysisshowed no isocyanate peak and the product was isolated:

Preparative Example 7

A 100 mL roundbottom equipped with overhead stirrer was charged with 8.0g (0.078 mol) propylene carbonate and 97 microliters of a solution ofDBTDL in MEK solution (providing 2353 ppm of DBTDL). The flask wasplaced in a 50° C. oil bath under dry air. Via an addition funnel, 33.36g (0.078 mol) of bis(3-trimethoxysilylpropyl)amine were reacted overabout 20 hours at 40° C. to provide the same urethane alcohol disilaneintermediate as in Preparative Example 6.

The flask was further charged with an additional 44 microliters of DBTDLsolution, and 18.75 g (0.078 mol) of BEI was added to the flask over thecourse of about 10 min. After reaction for about 1 day, FTIR analysisshowed no isocyanate peak and the product was isolated:

Composite Barrier Assembly and Barrier Film Preparation

Examples of multilayer composite barrier assemblies and barrier filmswere made on a vacuum coater similar to the coater described in U.S.Pat. No. 5,440,446 (Shaw et al.) and U.S. Pat. No. 7,018,713 (Padiyath,et al.).

Comparative Example 8 and Examples 9 through 13 below relate to formingsimulated barrier modules which were subjected to under conditionsdesigned to simulate aging in an outdoor environment and then subjectedto a peel adhesion test to determine if the diurethane(meth)acrylate-silane precursor compounds of the above PreparativeExamples were effective in improving peel adhesion. Some procedurescommon to all these Examples are presented first.

Composite films according to the examples below were laminated to a 0.05mm thick ethylene tetrafluoroethylene (ETFE) film commercially availableas NORTON® ETFE from St. Gobain Performance Plastics of Wayne, N.J.,using a 0.05 mm thick pressure sensitive adhesive (PSA) commerciallyavailable as 3M OPTICALLY CLEAR ADHESIVE 8172P from 3M Company, of St.Paul, Minn. The laminated barrier sheets formed in each Example belowwas then placed atop a 0.14 mm thick polytetrafluoroethylene (PTFE)coated aluminum-foil commercially available commercially as 8656K61,from McMaster-Carr, Santa Fe Springs, Calif. with 13 mm wide desiccatededge tape commercially available as SOLARGAIN Edge Tape SET LP01″ fromTruseal Technologies Inc. of Solon, Ohio) placed around the perimeter ofthe foil between the barrier sheet and the PTFE.

A 0.38 mm thick encapsulant film commercially available as JURASOL fromJuraFilms of Downer Grove, Ill. and an additional layer of the laminatedbarrier sheet were placed on the backside of the foil with theencapsulant between the barrier sheet and the foil. The multi-componentconstructions were vacuum laminated at 150° C. for 12 min.

Test Methods

Aging Test

Some of the laminated constructions described above were aged for 250hrs and 500 hours in an environmental chamber set to conditions of 85°C. and 85% relative humidity.

T-Peel Adhesion Test

Unaged and aged barrier sheets were cut away from the PTFE surface anddivided into 1.0 inch (25.4 mm) wide strips for adhesion testing usingthe ASTM D1876-08 T-peel test method. The samples were peeled by a peeltester commercially available as INISIGHT 2 SL equipped with TESTWORKS 4software commercially available from MTS of Eden Prairie, Minn. A peelrate of 10 in/min (25.4 cm/min) was used. The reported adhesion value inTable II below is the average of four peel measurements.

Example 8 (Comparative)

This example is comparative in the sense that no coupling agents asdescribed in Examples 1 through 7 were used. A polyetheyleneterephthalate (PET) substrate film was covered with a stack of anacrylate smoothing layer, an inorganic silicon aluminum oxide (SiAlOx)barrier and an acrylate protective layer. The individual layers wereformed as follows:

(Deposition of the (Meth)Acrylate Smoothing Layer)

A 305 meter long roll of 0.127 mm thick by 366 mm wide PET filmcommercially available XST 6642 from Dupont of Wilmington, Del. wasloaded into a roll-to-roll vacuum processing chamber. The chamber waspumped down to a pressure of 1×10⁻⁵ Torr. The web speed was maintainedat 4.8 meter/min while maintaining the backside of the film in contactwith a coating drum chilled to −10° C. With the film in contact with thedrum, the film surface was treated with a nitrogen plasma at 0.02 kW ofplasma power. The film surface was then coated with tricyclodecanedimethanol diacrylate commercially available as SR-833S from SartomerUSA, LLC, Exton, Pa.). More specifically, the diacrylate was degassedunder vacuum to a pressure of 20 mTorr prior to coating, loaded into asyringe pump, and pumped at a flow rate of 1.33 mL/min through anultrasonic atomizer operated at a frequency of 60 kHz into a heatedvaporization chamber maintained at 260° C. The resulting monomer vaporstream condensed onto the film surface and was electron beam crosslinkedusing a multi-filament electron-beam cure gun operated at 7.0 kV and 4mA to form a 720 nm acrylate layer.

(Deposition of the Inorganic Silicon Aluminum Oxide (SiAlOx) Barrier)

Immediately after the acrylate deposition and with the film still incontact with the drum, a SiAlOx layer was sputter-deposited atop theacrylate-coated web surface. Two alternating current (AC) power supplieswere used to control two pairs of cathodes; with each cathode housingtwo 90% Si/10% Al targets commercially available from Materion ofAlbuquerque, N. Mex. During sputter deposition, the voltage signal fromeach power supply was used as an input for aproportional-integral-differential control loop to maintain apredetermined oxygen flow to each cathode. The AC power suppliessputtered the 90% Si/10% Al targets using 5000 watts of power, with agas mixture containing 450 sccm argon and 63 sccm oxygen at a sputterpressure of 3.5 millitorr. This provided a 30 nm thick SiAlOx layerdeposited atop the acrylate discussed above.

(Deposition of the (Meth)Acrylate Protective Layer)

Immediately after the SiAlOx layer deposition and with the film still incontact with the drum, an acrylate protective layer second was coatedand crosslinked on the same web generally using the same conditions asfor the deposition of the smoothing layer, but with the followingexceptions. The electron beam crosslinking was carried out using amulti-filament electron-beam cure gun operated at 7 kV and 5 mA. Thisprovided a 720 nm thick acrylate layer atop Layer 2.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis) of 87%, determined by averagingthe percent transmission T between 400 nm and 700 nm, measured at a 0°angle of incidence. A water vapor transmission rate (WVTR) was measuredin accordance with ASTM F-1249 at 50° C. and 100% relative humidity (RH)using MOCON PERMATRAN-W® Model 700 WVTR testing system commerciallyavailable from MOCON, Inc, Minneapolis, Minn.). The result was below the0.005 g/m²/day lower detection limit rate of the apparatus.

The resulting three layer stack was used to form a simulated solarmodule construction as discussed in the section on general proceduresabove. These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 9

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing theinvention molecules. The individual layers were formed as in ComparativeExample 8 except during the formation of the protective layer, insteadof 100% tricyclodecane dimethanol diacrylate SR-833S being used, amixture of 97% by weight of tricyclodecane dimethanol diacrylate SR-833Sand 3% by weight of the compound synthesized in Preparatory Example 2above was used instead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 10

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing theinvention molecules. The individual layers were formed as in ComparativeExample 8 except during the formation of the protective layer, insteadof 100% tricyclodecane dimethanol diacrylate SR-833S being used, amixture of 97% by weight of tricyclodecane dimethanol diacrylate SR-833Sand 3% by weight of the compound synthesized in Preparatory Example 3above was used instead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 11

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing theinvention molecules. The individual layers were formed as in ComparativeExample 8 except during the formation of the protective layer, insteadof 100% tricyclodecane dimethanol diacrylate SR-833S being used, amixture of 97% by weight of tricyclodecane dimethanol diacrylate SR-833Sand 3% by weight of the compound synthesized in Preparatory Example 4above was used instead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 12

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing theinvention molecules. The individual layers were formed as in ComparativeExample 8 except during the formation of the protective layer, insteadof 100% tricyclodecane dimethanol diacrylate SR-833S being used, amixture of 97% by weight of tricyclodecane dimethanol diacrylate SR-833Sand 3% by weight of the compound synthesized in Preparatory Example 6above was used instead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 13

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing theinvention molecules. The individual layers were formed as in ComparativeExample 8 except during the formation of the protective layer, insteadof 100% tricyclodecane dimethanol diacrylate SR-833S being used, amixture of 97% by weight of tricyclodecane dimethanol diacrylate SR-833Sand 3% by weight of the compound synthesized in Preparatory Example 7above was used instead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

Example 14 (Comparative)

A poly(ethylene) terephthalate (PET) substrate film was covered with astack of an acrylate smoothing layer, an inorganic silicon aluminumoxide (SiAlOx) barrier and an acrylate protective layer containing thedisclosure molecules. The individual layers were formed as inComparative Example 8 except during the formation of the protectivelayer, instead of 100% tricyclodecane dimethanol diacrylate SR-833Sbeing used, a mixture of 97% by weight of tricyclodecane dimethanoldiacrylate SR-833S and 3% by weight ofN-n-butyl-AZA-2,2-dimethoxysilacyclopentane (commercially available fromGelest, Morrisville, Pa., under the product code 1932.4) was usedinstead.

The resulting three layer stack on the (co)polymeric substrate exhibitedan average spectral transmission T_(vis)=87% and a below the 0.005g/m²/day, both tested as described in Comparative Example 8. Then theresulting three layer stack was used to form a simulated solar moduleconstruction as discussed in the section on general procedures above.These simulated solar modules were subjected to accelerated agingaccording to the aging test, and then the T-peel adhesion was assessedas discussed above. The results of the T-peel adhesion test arepresented in Table 2 below.

TABLE 2 Test Results for Examples 8-13 T-Peel After Aging T-Peel AfterAging 250 Hours 1000 Hours T-Peel @ 85° C./ @ 85° C./ Initial 85% RH 85%RH Example (N/cm) (N/cm) (N/cm) 8 0.3 0.1 0.1 (Comparative) 9 9.8 10.311.0 10 0.3 0.1 0.2 11 9.3 9.8 — 12 8.6 9.5 5.5 13 8.9 10.0 0.4 14 6.010.1 0.4 (Comparative)

While the specification has described in detail certain exemplaryembodiments, it will be appreciated that those skilled in the art, uponattaining an understanding of the foregoing, may readily conceive ofalterations to, variations of, and equivalents to these embodiments.Accordingly, it should be understood that this disclosure is not to beunduly limited to the illustrative embodiments set forth hereinabove.Furthermore, all publications, published patent applications and issuedpatents referenced herein are incorporated by reference in theirentirety to the same extent as if each individual publication or patentwas specifically and individually indicated to be incorporated byreference. Various exemplary embodiments have been described. These andother embodiments are within the scope of the following listing ofdisclosed embodiments and claims.

The invention claimed is:
 1. A composition of matter, comprising: atleast one diurethane (meth)acrylate-silane compound of the formula:R_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),wherein: R_(A) is a (meth)acryl group containing group of the formulaR¹¹-(A)_(n), further wherein: R¹¹ is a polyvalent alkylene, arylene,alkarylene, or aralkylene group, said alkylene, arylene, alkarylene, oraralkylene groups optionally containing one or more catenary oxygenatoms, A is a (meth)acryl group comprising the formulaX²—C(O)—C(R³)═CH₂, additionally wherein: X² is —O, —S, or —NR³, R³ isindependently H, or C₁-C₄ alkyl, and n=1 to 5; each R¹², R¹³, R¹⁴, R¹⁵,R¹⁶, and R¹⁷ is independently H, a linear, branched or cyclic alkylgroup of 1 to 6 carbon atoms, optionally comprising 1 to 3 catenaryoxygen, sulfur, or nitrogen atoms, and optionally substituted with oneor more hydroxyl groups; R_(S) is a silane containing group of theformula —R¹—[Si(Y_(p))(R²)_(3-p)]_(q), wherein: R¹ is a polyvalentalkylene, arylene, alkarylene, or aralkylene group, said alkylene,arylene, alkarylene, or aralkylene group optionally containing one ormore catenary oxygen atoms, Y is a hydrolysable group, R² is amonovalent alkyl or aryl group, p is 1, 2, or 3, and q is independently1 to 5; R⁵ is H, C₁ to C₆ alkyl, C₃ to C₆ cycloalkyl, or R_(S); and a is0, 1, or
 2. 2. A composition of matter according to claim 1, whereineach hydrolysable group Y is independently selected from an alkoxygroup, an acetate group, an aryloxy group, and a halogen.
 3. Acomposition of matter according to claim 2, wherein at least some of thehydrolysable groups Y are alkoxy groups.
 4. An article, comprising: asubstrate selected from a (co)polymeric film or an electronic device,the electronic device further comprising an organic light emittingdevice (OLED), an electrophoretic light emitting device, a liquidcrystal display, a thin film transistor, a photovoltaic device, or acombination thereof; a base (co)polymer layer on a major surface of thesubstrate; an oxide layer on the base (co)polymer layer; and aprotective (co)polymer layer on the oxide layer, wherein the protective(co)polymer layer comprises the reaction product of at least onediurethane (meth)acrylate-silane precursor compound of the formula:R_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),wherein: R_(A) is a (meth)acryl group containing group of the formulaR¹¹-(A)_(n), further wherein: R¹¹ is a polyvalent alkylene, arylene,alkarylene, or aralkylene group, said alkylene, arylene, alkarylene, oraralkylene groups optionally containing one or more catenary oxygenatoms, A is a (meth)acryl group comprising the formulaX²—C(O)—C(R³)═CH₂, additionally further wherein: X² is —O, —S, or —NR³,R³ is independently H, or C₁-C₄ alkyl, and n=1 to 5; each R¹², R¹³, R¹⁴,R¹⁵, R¹⁶, and R¹⁷ is independently H, a linear, branched or cyclic alkylgroup of 1 to 6 carbon atoms optionally comprising 1 to 3 catenaryoxygen, sulfur, or nitrogen atoms, and optionally substituted with oneor more hydroxyl groups; R_(S) is a silane containing group of theformula —R¹—[Si(Y_(p))(R²)_(3-p)]_(q), wherein: R¹ is a polyvalentalkylene, arylene, alkarylene, or aralkylene group, said alkylene,arylene, alkarylene, or aralkylene group optionally containing one ormore catenary oxygen atoms, Y is a hydrolysable group, R² is amonovalent alkyl or aryl group p is 1, 2, or 3, and q is independently 1to 5; R⁵ is H, C₁ to C₆ alkyl, C₃ to C₆ cycloalkyl, or R_(S); and a is0, 1, or
 2. 5. The article of claim 4, wherein each hydrolysable group Yis independently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen.
 6. The article of claim 5, wherein atleast some of the hydrolysable groups Y are alkoxy groups.
 7. Thearticle of claim 4, further comprising a plurality of alternating layersof the oxide layer and the protective (co)polymer layer on the base(co)polymer layer.
 8. The article of claim 4, wherein the substratecomprises a flexible transparent (co)polymeric film, optionally whereinthe substrate comprises polyethylene terephthalate (PET), polyethylenenapthalate (PEN), heat stabilized PET, heat stabilized PEN,polyoxymethylene, polyvinylnaphthalene, polyetheretherketone,fluoro(co)polymer, polycarbonate, polymethylmethacrylate, poly α-methylstyrene, polysulfone, polyphenylene oxide, polyetherimide,polyethersulfone, polyamideimide, polyimide, polyphthalamide, orcombinations thereof.
 9. The article of claim 4, wherein the base(co)polymer layer comprises an acrylate smoothing layer.
 10. The articleof claim 4, wherein the oxide layer comprises oxides, nitrides, carbidesor borides of atomic elements from Groups IIA, IIIA, IVA, VA, VIA, VIIA,IB, or IIB, metals of Groups IIIB, IVB, or VB, rare-earth metals, orcombinations thereof.
 11. The article of claim 4, further comprising anoxide layer applied to the protective (co)polymer layer, optionallywherein the oxide layer comprises silicon aluminum oxide.
 12. Anelectronic device incorporating the article according to claim 4,wherein the substrate is a (co)polymer film and the electronic device isselected from a solid state lighting device, a display device, andcombinations thereof.
 13. A process, comprising: (a) applying a base(co)polymer layer to a major surface of a substrate selected from a(co)polymeric film or an electronic device, the electronic devicefurther comprising an organic light emitting device (OLED), anelectrophoretic light emitting device, a liquid crystal display, a thinfilm transistor, a photovoltaic device, or a combination thereof; (b)applying an oxide layer on the base (co)polymer layer; and (c)depositing on the oxide layer a protective (co)polymer layer, whereinthe protective (co)polymer layer comprises the reaction product of atleast one diurethane (meth)acrylate-silane precursor compound of theformula:R_(A)—NH—C(O)—O—C(R¹²R¹³)—C(R¹⁴R¹⁵)—[C(R¹⁶R¹⁷)]_(a)—O—C(O)—N(R⁵)—R_(S),wherein: R_(A) is a (meth)acryl group containing group of the formulaR¹¹-(A)_(n), further wherein: R¹¹ is a polyvalent alkylene, arylene,alkarylene, or aralkylene group, said alkylene, arylene, alkarylene, oraralkylene groups optionally containing one or more catenary oxygenatoms, A is a (meth)acryl group comprising the formulaX²—C(O)—C(R³)═CH₂, additionally wherein: X² is —O, —S, or —NR³, and R³is independently H, or C₁-C₄ alkyl, and n=1 to 5; each R¹², R¹³, R¹⁴,R¹⁵, R¹⁶, and R¹⁷ is independently H, a linear, branched or cyclic alkylgroup of 1 to 6 carbon atoms, optionally comprising 1 to 3 catenaryoxygen, sulfur, or nitrogen atoms, and optionally substituted with oneor more hydroxyl groups; and R_(S) is a silane containing group of theformula —R¹—[Si(Y_(p))(R²)_(3-p)]_(q), wherein: R¹ is a polyvalentalkylene, arylene, alkarylene, or aralkylene group, said alkylene,arylene, alkarylene, or aralkylene group optionally containing one ormore catenary oxygen atoms, Y is a hydrolysable group, R² is amonovalent alkyl or aryl group; p is 1, 2, or 3, and q is independently1 to 5; R⁵ is H, C₁ to C₆ alkyl, C₃ to C₆ cycloalkyl, or R_(S); and a is0, 1, or
 2. 14. The process of claim 13, wherein each hydrolysable groupY is independently selected from an alkoxy group, an acetate group, anaryloxy group, and a halogen.
 15. The process of claim 13, wherein theat least one diurethane (meth)acrylate-silane precursor compoundundergoes a chemical reaction to form the protective (co)polymer layerat least in part on the oxide layer, optionally wherein the chemicalreaction is selected from a free radical polymerization reaction, and ahydrolysis reaction.
 16. The process of claim 13, wherein step (a)comprises: (i) evaporating the base (co)polymer precursor; (ii)condensing the evaporated base (co)polymer precursor onto the substrate;and (iii) curing the evaporated base (co)polymer precursor to form thebase (co)polymer layer.
 17. The process of claim 13, wherein step (b)comprises depositing an oxide onto the base (co)polymer layer to formthe oxide layer, wherein depositing is achieved using sputterdeposition, reactive sputtering, chemical vapor deposition, or acombination thereof.
 18. The process of any claim 13, further comprisingsequentially repeating steps (b) and (c) to form a plurality ofalternating layers of the protective (co)polymer layer and the oxidelayer on the base (co)polymer layer.
 19. The process claim 13, whereinstep (c) further comprises at least one of co-evaporating the at leastone diurethane (meth)acrylate-silane precursor compound with a(meth)acrylate compound from a liquid mixture, or sequentiallyevaporating the at least one diurethane (meth)acrylate-silane precursorcompound and a (meth)acrylate compound from separate liquid sources,optionally wherein the liquid mixture comprises no more than about 10wt. % of the diurethane (meth)acrylate-silane precursor compound. 20.The process of claim 13, wherein step (c) further comprises at least oneof co-condensing the diurethane (meth)acrylate-silane precursor compoundwith the (meth)acrylate compound onto the oxide layer, or sequentiallycondensing the diurethane (meth)acrylate-silane precursor compound andthe (meth)acrylate compound on the oxide layer.